Microsoldering Methods

The Xii-Boy Ultra requires advanced soldering methods in order to complete the build. It is highly reccomended to practice the follwoing methods on a junk PCB before bringing the iron near the Wii or other custom PCBs.

Scraping Vias

The vias on the Wii’s motherboard are coated with conformal coating, and the copper isn’t fully exposed. Copper has to be exposed for solder to bond, so the conformal coating needs scraped off.

1. Prepare the X-Acto knife with a #2 blade.
2. Gently scrape along the edge of the via with the tip of the blade. Move it in a circular motion until the copper is fully exposed. Remember, only the conformal coating should be scraped. Do not scrape away the copper!
3. Clean conformal coating flakes using a Q-tip and 99% isopropyl alcohol.

General Soldering

Solder is like the glue for electronics. It holds components together and is conductive, meaning electricity can flow through it freely. A soldering iron is the tool that melts the solder so you can make your own connections. A good soldering iron is one that is temperature-controlled and conducts heat well. The recommended soldering iron temperature for everything in the Xii-Boy Ultra build is 350°C. The only exception to this is a pad or component which sinks in a lot of heat (e.g., the 1.8V LDO). The iron’s tip greatly affects heat transfer. A conical tip will be nowhere near as effective as a TS-D24 tip or similar, however conical tips can still be useful for tiny pins.

Here is the general soldering process:

1. Power on the iron and set it to 350°C.
2. Clean residual solder off the tip using a brass wool or a damp sponge.
3. Apply flux to the pad that will be soldered. The flux helps the solder flow and prevents bridging pads.
4. Place the soldering iron on the pad. Allow it to heat the pad for a second.
5. Put the end of the solder roll on the joint between the iron tip and the pad. Allow the solder to melt briefly before removing the solder roll. Then, remove the iron.
6. Inspect for bridged component leads, pads, or vias. If necessary, apply flux and reflow the joint with the iron.
7. Clean residual flux using a Q-tip and 99% isopropyl alcohol.